A new generation of encapsulated miniature detection modules with broadband electronics

Agreement no. POIR 03.02.02-00-0209/16-00
Duration: 01/02/2016 – 31/03/2019
Overall budget: PLN 3, 864,400.00 
Eligible costs: PLN 21,943,080.00
Co-funding (27,34% of eligible costs): PLN 6,000,000.00

In October 2016, VIGO System S.A. signed an agreement, as a result of which it received a subsidy – Loan for technological innovations of the Smart Growth Operational Program (POIR), co-funded by the European Regional Development Fund.

The investment is located in Mazowieckie Voivodship within Industrial Park of Tarnobrzeg Special Economic Zone Euro – Park WISŁOSAN.

The co-financed project entitled: “New generation of hermetically sealed miniature detector modules with broadband electronics” concerns production implementation of own, new technology developed at VIGO through technological investment and launching of the production of new generation detector modules with broadband electronics in hermetically sealed miniature casings – new products on the global market. Financial support from the EU funds for the implementation of the new technology will increase the competitiveness and innovation of VIGO. This technology is an intangible asset of the company and was created as a result of a research project entitled: “The integration of thermoelectrically cooled infrared detectors or operating at ambient temperature with a broadband receiving system” in a scientific and industrial consortium. The products, which will be the result of the Project – INTIR modules, are the novelty in the field of uncooled photon infrared detectors on the global market. Introduction of miniaturized, universal, and easier to use single- and multi-element modules will be a breakthrough innovation. New functionalities of INTIR modules – mainly miniaturization and ease of use while maintaining high quality parameters (or higher) such as detectability or operation speed will cause development of photonic industry, and consequently also the industry of final device producers, e.g. various types of sensors. They will not need to have expertise in infrared detectors and their integration into electronics, and the module will be a standard optoelectronic component.