Development and implementation of an innovative technology for bonding infrared sensors
|Project duration:||01.04.2019 – 16.08.2020|
|Contractor:||Państwowy Instytut Automatyki i Pomiarów|
|Overall budget:||797 040,00 PLN|
|Co-funding:||400 000,00 PLN|
The subject of the project is the development and implementation on the demonstrator of a significantly improved, innovative technology for gluing elements of infrared sensors, used in the defense industry, medicine, transport and environmental protection.
The developed technology includes 2 operations of gluing: glass (window) to the detector case and detector case to the header.