Development and implementation of an innovative technology for bonding infrared sensors

Project duration: 01.04.2019 – 16.08.2020
Contractor: Państwowy Instytut Automatyki i Pomiarów
Overall budget: 797 040,00 PLN
Co-funding: 400 000,00 PLN

Project description:

The subject of the project is the development and implementation on the demonstrator of a significantly improved, innovative technology for gluing elements of infrared sensors, used in the defense industry, medicine, transport and environmental protection.

The developed technology includes 2 operations of gluing: glass (window) to the detector case and detector case to the header.