Development and implementation of an innovative technology for bonding infrared sensors

Agreement no. POIR.02.03.02-14-0210/18-00
Duration: 01/04/2019 – 30/11/2020
Overall budget: PLN 797,040.00
Eligible costs: PLN 400,000.00
Co-funding: PLN 340,000.00
Contractor: Państwowy Instytut Automatyki i Pomiarów

The subject of the project is the development and implementation on the demonstrator of a significantly improved, innovative technology for gluing elements of infrared sensors, used in the defense industry, medicine, transport and environmental protection.

The developed technology includes 2 operations of gluing: glass (window) to the detector case and detector case to the header.